PA0196

join

new-10%

Manufacturer part number:PA0196

Manufacturer:Chip Quik Inc.

Description:TSSOP-64-EXP-PAD TO DIP-64 SMT

Case Package:SOT-23

Datasheet:PA0196 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Material	FR4 Epoxy Glass
Package Accepted	TSSOP
Published	2009
Series	Proto-Advantage
Size / Dimension	1.000 x 3.200 25.40mmx81.28mm
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Positions	64
Pitch	0.020 0.50mm
Proto Board Type	SMD to DIP
Board Thickness	0.062 1.57mm 1/16
RoHS Status	ROHS3 Compliant