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SBB0802P-1

SBB0802P-1

SBB0802P-1

Chip Quik Inc.

SOLDER-IN BREADBOARD 1X1" (8 ROW

SOT-23

SBB0802P-1 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 4 Weeks
Material FR4 Epoxy Glass
Series Proto-Advantage
Size / Dimension 1.00Lx1.00W 25.4mmx25.4mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Pitch 0.1 2.54mm Grid
Plating Plated Through Hole (PTH)
Hole Diameter 0.039 (1.00mm)
Proto Board Type Breadboard, General Purpose
Circuit Pattern Pad Per Hole (Round)
Board Thickness 0.063 1.60mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2.38000 $2.38

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