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SMDLTLFP500T3

SMDLTLFP500T3

SMDLTLFP500T3

Chip Quik Inc.

SMDLTLFP500T3 datasheet pdf and Solder product details from Chip Quik Inc. stock available on our website

SOT-23

SMDLTLFP500T3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Packaging Jar
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Solder Paste
Composition Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Shelf Life 6 Months, 2 Months
Storage/Refrigeration Temperature 37°F~46°F 3°C~8°C
Shelf Life Start Date of Manufacture
Form Jar, 17.64 oz (500g)
Process Lead Free
Melting Point 281°F 138°C
Flux Type No-Clean
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $127.95000 $127.95

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