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0191640004

0191640004

0191640004

Molex

0191640004 datasheet pdf and Terminals - Ring Connectors product details from Molex stock available on our website

SOT-23

0191640004 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Contact MaterialCopper Alloy
Mounting Type Free Hanging (In-Line)
Material - Insulation NiAc
PackagingBulk
Series Perma-Seal
Feature Serrated Termination
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
ECCN Code EAR99
Color Red
HTS Code8536.90.40.00
Contact Finish Tin
Wire Gauge18-22 AWG
Terminal and Terminal Block Type RING TERMINAL
Insulation Diameter 0.235 (5.97mm)
Insulation Insulated with Heat Shrink
Terminal TypeCircular
Wire Cross Section 0.96 mm2
Stud/Tab Size 1/4 Stud
Thickness 0.028 0.71mm
Length - Overall 1.661 42.20mm
Width - Outer Edges 0.480 12.19mm
RoHS StatusROHS3 Compliant
In-Stock:7320 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.050000$1.05
10$0.990566$9.90566
100$0.934496$93.4496
500$0.881600$440.8
1000$0.831698$831.698

About 0191640004

The 0191640004 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features 0191640004 datasheet pdf and Terminals - Ring Connectors product details from Molex stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0191640004, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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