0444280801 datasheet pdf and Rectangular Connectors - Headers, Male Pins product details from Molex stock available on our website
SOT-23
0444280801 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Contact Material
Brass
Mounting Type
Through Hole, Right Angle
Contact Shape
Square
Insulation Material
Polyamide (PA), Nylon, Glass Filled
Packaging
Tray
Series
Micro-Fit 3.0 BMI 44428
JESD-609 Code
e3
Feature
Board Lock
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
Solder
Connector Type
Header
Number of Positions
8
Applications
General Purpose, Medical, Military, Telecommunications
Number of Rows
2
Fastening Type
Push-Pull
Contact Finish - Mating
Tin
MIL Conformance
NO
DIN Conformance
NO
IEC Conformance
NO
Filter Feature
NO
Contact Type
Male Pin
Mixed Contacts
NO
Terminal Pitch
3mm
Insulation Height
0.469 11.90mm
Style
Board to Board or Cable
Number of Positions Loaded
All
Pitch - Mating
0.118 3.00mm
Insulation Color
Black
Row Spacing - Mating
0.118 (3.00mm)
Contact Length - Post
0.138 3.50mm
Shrouding
Shrouded - 4 Wall
UL Flammability Code
94V-0
Contact Finish Thickness - Mating
200.0μin 5.08μm
Contact Finish Thickness - Post
200.0μin 5.08μm
Material Flammability Rating
UL94 V-0
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$3.150502
$3.150502
10
$2.972172
$29.72172
100
$2.803936
$280.3936
500
$2.645222
$1322.611
1000
$2.495493
$2495.493
0444280801 Product Details
0444280801 Overview
The product is packaged in Header.Through Hole, Right Angle is the mount type.It is necessary to use a Tray case for packaging the product.The product is part of the Micro-Fit 3.0 BMI 44428 Series.The device may be used for the following applications: General Purpose, Medical, Military, Telecommunications.Its Board Lock feature renders it more powerful in many ways.
0444280801 Features
Micro-Fit 3.0 BMI 44428 series
0444280801 Applications
There are a lot of Molex 0444280801 Rectangular Connectors applications.