0°C~100°C TJ System On Chip Arria 10 SX Series 360 I/O
SOT-23
10AS027E1F29E1HG Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
780-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Arria 10 SX
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
360
Speed
1.5GHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
FPGA - 270K Logic Elements
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3
$1,523.00667
$3
10AS027E1F29E1HG Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 780-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Arria 10 SX is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines FPGA - 270K Logic Elements and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 360 I/Os in total.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA.
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10AS027E1F29E1HG System On Chip (SoC) applications.