-40°C~100°C TJ System On Chip Arria 10 SX Series 360 I/O
SOT-23
10AS027E1F29I1HG Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
780-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Arria 10 SX
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
360
Speed
1.5GHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
FPGA - 270K Logic Elements
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3
$1,740.00333
$3
10AS027E1F29I1HG Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 780-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Arria 10 SX series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 270K Logic Elements together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 360 I/Os.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA.
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10AS027E1F29I1HG System On Chip (SoC) applications.