-40°C~100°C TJ System On Chip Arria 10 SX Series 360 I/O
SOT-23
10AS048E1F29I1HG Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
8 Weeks
Package / Case
780-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Arria 10 SX
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
360
Speed
1.5GHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
FPGA - 480K Logic Elements
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3
$3,105.00333
$9
10AS048E1F29I1HG Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC is built.Package 780-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Arria 10 SX.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 480K Logic Elements.A state-of-the-art Tray package houses this SoC system on a chip.360 I/Os are included in this SoC part.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA.
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10AS048E1F29I1HG System On Chip (SoC) applications.