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10AX016E3F29E1HG

10AX016E3F29E1HG

10AX016E3F29E1HG

Intel

FPGAs Arria 10 GX Series 780-BBGA, FCBGA

SOT-23

10AX016E3F29E1HG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.98V
Number of I/O 288
Number of Logic Elements/Cells 160000
Total RAM Bits 10086400
Number of LABs/CLBs 61510
RoHS StatusRoHS Compliant
In-Stock:1381 items

Pricing & Ordering

QuantityUnit PriceExt. Price
3$639.00333$1917.00999

10AX016E3F29E1HG Product Details

10AX016E3F29E1HG Overview


A 780-BBGA, FCBGA package is provided with this component. Having 288 I/Os makes data transfers more coherent. A fundamental building block consists of 160000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order for it to operate, the supply voltage must be 0.87V~0.98V . There are many types of FPGAs in the Arria 10 GX series, this is one of them. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 10086400 bFpga chipss. A total of 61510 LABs/CLBs make up this FPGA array.

10AX016E3F29E1HG Features


288 I/Os
Up to 10086400 RAM bits

10AX016E3F29E1HG Applications


There are a lot of Intel 10AX016E3F29E1HG FPGAs applications.

  • Wired Communications
  • Audio
  • Data center search engines
  • Military DSP
  • Aerospace and Defense
  • Solar Energy
  • Automation
  • Bioinformatics
  • Medical imaging
  • Artificial intelligence (AI)

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