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10AX090U1F45I1SG

10AX090U1F45I1SG

10AX090U1F45I1SG

Intel

3.65mm mm FPGAs Arria 10 GX Series 1932-BBGA, FCBGA 1mm mm

SOT-23

10AX090U1F45I1SG Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 GX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.98V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Terminal Pitch 1mm
JESD-30 Code S-PBGA-B1932
Number of I/O 480
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 900000
Total RAM Bits 59234304
Number of LABs/CLBs 339620
Height Seated (Max) 3.65mm
Length 45mm
Width 45mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
10AX090U1F45I1SG Product Details

10AX090U1F45I1SG Overview


There are two packages that contain fpga chips: 1932-BBGA, FCBGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. 480 I/Os are available for transferring data more efficiently. The basic building blocks of logic contain 900000 logic elements/cells. Power is provided by a 0.9V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. A supply voltage of 0.87V~0.98V is needed in order for fpga chips to operate. An FPGA belonging to the Arria 10 GX series is referred to as an FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 59234304 bFpga chipss. A total of 339620 LABs/CLBs are included in this FPGA.

10AX090U1F45I1SG Features


480 I/Os
Up to 59234304 RAM bits

10AX090U1F45I1SG Applications


There are a lot of Intel 10AX090U1F45I1SG FPGAs applications.

  • Military Temperature
  • Data center hardware accelerators
  • Automotive advanced driver assistance systems (ADAS)
  • Electronic Warfare
  • Space Applications
  • Voice recognition
  • Military DSP
  • Artificial intelligence (AI)
  • Industrial Ethernet
  • High Performance Computing

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