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10CL016YF484C6G

  • 10CL016YF484C6G - 2.4mm mm FPGAs Cyclone? 10 LP Series 484-FBGA 1mm mm 484
  • 10CL016YF484C6G - 2.4mm mm FPGAs Cyclone? 10 LP Series 484-FBGA 1mm mm 484

10CL016YF484C6G

10CL016YF484C6G

Intel

2.4mm mm FPGAs Cyclone? 10 LP Series 484-FBGA 1mm mm 484

SOT-23

10CL016YF484C6G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 484-FBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingTray
Series Cyclone® 10 LP
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Voltage - Supply 1.2V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of I/O 340
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 15408
Total RAM Bits 516096
Number of LABs/CLBs 963
Number of CLBs 963
Height Seated (Max) 2.4mm
Length 23mm
Width 23mm
RoHS StatusRoHS Compliant
In-Stock:1158 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$30.74000$30.74
25$29.20000$730
100$28.03200$2803.2

10CL016YF484C6G Product Details

10CL016YF484C6G Description


The 10CL016YF484C6G is an Intel® Cyclone® 10 LP Device.



10CL016YF484C6G Features


  • Low-cost, low-power FPGA fabric

  • 1.0 V and 1.2 V core voltage options

  • Available in commercial, industrial, and automotive temperature grades

  • Several package types and footprints:

    - FineLine BGA (FBGA)

    - Enhanced Thin Quad Flat Pack (EQFP)

    - Ultra FineLine BGA (UBGA)

    - Micro FineLine BGA (MBGA)

  • Multiple device densities with pin migration capability

  • RoHS6 compliance

  • Logic elements (LEs) -four-input look-up table (LUT) and register

  • Abundant routing/metal interconnect between all LEs



10CL016YF484C6G Applications


  • Industrial and automotive

  • Broadcast, wireline, and wireless

  • Compute and storage

  • Government, military, and aerospace

  • Medical, consumer, and smart energy


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