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10M16DAF484I6G

10M16DAF484I6G

10M16DAF484I6G

Intel

FPGAs MAX? 10 Series 484-BGA 484

SOT-23

10M16DAF484I6G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 484-BGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series MAX® 10
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish TIN SILVER COPPER
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of I/O 320
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 16000
Total RAM Bits 562176
Number of LABs/CLBs 1000
RoHS StatusRoHS Compliant
In-Stock:3393 items

10M16DAF484I6G Product Details

10M16DAF484I6G Overview


Fpga chips is supplied in the 484-BGA package. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. Having 320 I/Os makes data transfers more coherent. To form a fundamental building block, there are 16000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. In order to operate it, it requires a voltage supply of 1.15V~1.25V . It is a type of FPGA belonging to the MAX? 10 seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. A model of this FPGA is contained in Tray for the purpose of saving space. Total terminations are 484. Fpga electronics is worth mentioning that this device provides 562176 bfpga electronics s of RAM. A total of 1000 LABs/CLBs make up this FPGA array.

10M16DAF484I6G Features


320 I/Os
Up to 562176 RAM bits

10M16DAF484I6G Applications


There are a lot of Intel 10M16DAF484I6G FPGAs applications.

  • Filtering and communication encoding
  • Military DSP
  • Cryptography
  • Random logic
  • Image processing
  • Wireless Communications
  • Solar Energy
  • Distributed Monetary Systems
  • Enterprise networking
  • Device controllers

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