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10M50DAF256I6G

10M50DAF256I6G

10M50DAF256I6G

Intel

FPGAs MAX? 10 Series 256-LBGA 256

SOT-23

10M50DAF256I6G Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MAX® 10
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of I/O 178
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 50000
Total RAM Bits 1677312
Number of LABs/CLBs 3125
RoHS Status RoHS Compliant
10M50DAF256I6G Product Details

10M50DAF256I6G Overview


Fpga chips is supplied in the 256-LBGA package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. FPGA modules can be attached to development boards using a Surface Mount-connector. The supply voltage of the device is 1.15V~1.25V , at which it runs. The MAX? 10 Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. 256 terminations are present in total. This device has 1677312 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 3125 LABs/CLBs.

10M50DAF256I6G Features


178 I/Os
Up to 1677312 RAM bits

10M50DAF256I6G Applications


There are a lot of Intel 10M50DAF256I6G FPGAs applications.

  • Industrial,Medical and Scientific Instruments
  • Filtering and communication encoding
  • Medical Electronics
  • Medical ultrasounds
  • Medical imaging
  • Military Temperature
  • Digital signal processing
  • Telecommunication
  • Security systems
  • Voice recognition

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