10M50DAF484C6GES Overview

There are two packages that contain fpga chips: 484-BGA package and X package. A total of 360 I/Os are programmed to ensure a more coherent data transfer. There are 50000 logic elements/cells to form a fundamental building block. The Surface Mount-slot on the development board allows you to attach the FPGA module. With a supply voltage of 1.15V~1.25V, this device operates with ease. The FPGA belongs to the MAX? 10 series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1677312 bFpga chipss. The FPGA is built as an array of 3125 latches or CLBs. The device package supplied by 484-FBGA (23x23) is one of its suppliers.

10M50DAF484C6GES Features

360 I/Os
Up to 1677312 RAM bits

10M50DAF484C6GES Applications

There are a lot of Intel 10M50DAF484C6GES FPGAs applications.

• Military Temperature
• Distributed Monetary Systems
• Data Center
• Consumer Electronics
• Random logic
• Electronic Warfare
• High Performance Computing
• Device controllers
• Solar Energy
• Enterprise networking