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1SG110HN3F43E3VGS1

1SG110HN3F43E3VGS1

1SG110HN3F43E3VGS1

Intel

FPGAs Stratix? 10 GX Series 1760-BBGA, FCBGA

SOT-23

1SG110HN3F43E3VGS1 Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
Series Stratix® 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.77V~0.97V
Number of I/O 688
Number of Logic Elements/Cells 1100000
Number of LABs/CLBs 137500
In-Stock:2784 items

1SG110HN3F43E3VGS1 Product Details

1SG110HN3F43E3VGS1 Overview


A 1760-BBGA, FCBGA package is provided with this component. Fpga chips is programmed wFpga chipsh 688 I/Os for transferring data in a more coherent manner. A fundamental building block contains 1100000 logic elements or cells. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates at a voltage of 0.77V~0.97V and uses a battery to supply power. The Stratix? 10 GX series FPGA is a type of FPGA that belongs to the Stratix? 10 GX family of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Fpga electronics contains 137500 LABs/CLBs in an array.

1SG110HN3F43E3VGS1 Features


688 I/Os

1SG110HN3F43E3VGS1 Applications


There are a lot of Intel 1SG110HN3F43E3VGS1 FPGAs applications.

  • Aircraft navigation
  • Broadcast
  • Digital signal processing
  • Solar Energy
  • Space Applications
  • Ecosystem
  • Data center hardware accelerators
  • Data center search engines
  • Defense Applications
  • Medical imaging

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