1SG280HH3F55E2VGS3 Overview

There are two packages that contain fpga chips: 2912-BBGA, FCBGA package and X package. A total of 1160 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 2800000 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 0.77V~0.97V battery. There are many types of FPGAs in the Stratix? 10 GX series, this is one of them. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. This FPGA is built as an array of 350000 LABs/CLBs.

1SG280HH3F55E2VGS3 Features

1160 I/Os

1SG280HH3F55E2VGS3 Applications

There are a lot of Intel 1SG280HH3F55E2VGS3 FPGAs applications.

• Defense Applications
• Data center search engines
• Secure Communication
• Automation
• Medical Electronics
• Security systems
• Computer hardware emulation
• Software-defined radio
• Wireless Communications
• Radar and Sensors