1SG280HU3F50E2LG Overview
There are two packages that contain fpga chips: 2397-BBGA, FCBGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 704 I/Os allow data to be transferred in a more coherent manner. In order to construct a fundamental building block, 2800000 logic elements/cells are required. Using a Surface Mount connector, you can mount this FPGA module on the development board. There is a 0.82V~0.88V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the Stratix? 10 GX series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. An array of 350000 LABs/CLBs is built into the FPGA.
1SG280HU3F50E2LG Features
704 I/Os
1SG280HU3F50E2LG Applications
There are a lot of Intel 1SG280HU3F50E2LG FPGAs applications.
- Automotive
- Secure Communication
- Random logic
- Integrating multiple SPLDs
- Aerospace and Defense
- Development Boards and Shields for Microcontrollers
- Distributed Monetary Systems
- Embedded Vision
- Computer hardware emulation
- Telecommunication
