1SG280LU2F50E2LGS3 Overview

There are two packages that contain fpga chips: 2397-BBGA, FCBGA package and X package. Its 704 I/Os help it transfer data more efficiently. A fundamental building block is made up of 2800000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.82V~0.88V battery. The Stratix? 10 GX Series is one of the types of FPGAs that belong to this type. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. Fpga electronics contains 350000 LABs/CLBs in an array.

1SG280LU2F50E2LGS3 Features

704 I/Os

1SG280LU2F50E2LGS3 Applications

There are a lot of Intel 1SG280LU2F50E2LGS3 FPGAs applications.

• Bioinformatics
• Consumer Electronics
• Radar and Sensors
• Voice recognition
• Electronic Warfare
• ASIC prototyping
• High Performance Computing
• Image processing
• Camera time adjustments
• DO-254