0°C~85°C TJ 5CSXFC6 System On Chip Cyclone® V SX Series MCU - 181, FPGA - 145 I/O
SOT-23
5CSXFC6C6U23C8NES Datasheet
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Specifications
Name
Value
Type
Parameter
Package / Case
672-FBGA
Supplier Device Package
672-UBGA (23x23)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
Cyclone® V SX
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
5CSXFC6
Number of I/O
MCU - 181, FPGA - 145
Speed
600MHz
RAM Size
64KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA, POR, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
FPGA - 110K Logic Elements
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$213.650320
$213.65032
10
$201.556906
$2015.56906
100
$190.148024
$19014.8024
500
$179.384928
$89692.464
1000
$169.231065
$169231.065
5CSXFC6C6U23C8NES Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processors in this SoC.This system on a chip is packaged as 672-FBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Cyclone® V SX series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 110K Logic Elements.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of MCU - 181, FPGA - 145 I/Os.By searching 5CSXFC6, you can find system on chips with similar specs and purposes.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
64KB RAM. Built on MCU, FPGA.
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5CSXFC6C6U23C8NES System On Chip (SoC) applications.