There are two packages that contain fpga chips: 484-BBGA, FCBGA package and X package. This device features 303 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 4800 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. The supply voltage of the device is 1.71V~1.89V , at which it runs. FPGAs belonging to the Mercury series are a type of FPGA that belong to the Mercury series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 49152. A total of 480 LABs/CLBs make up this FPGA array. The building block that forms the basis of the system contains 120000 gates. This device package is supplied by 484-FBGA (23x23).
EP1M120F484C8ES Features
303 I/Os Up to 49152 RAM bits
EP1M120F484C8ES Applications
There are a lot of Intel EP1M120F484C8ES FPGAs applications.