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EP20K300EBC672-1X

EP20K300EBC672-1X

EP20K300EBC672-1X

Intel

FPGAs APEX-20KE? Series 672-BBGA

SOT-23

EP20K300EBC672-1X Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 672-BBGA
Supplier Device Package 672-FBGA (27x27)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series APEX-20KE®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.71V~1.89V
Number of I/O 408
Number of Logic Elements/Cells 11520
Total RAM Bits 147456
Number of Gates 728000
Number of LABs/CLBs 1152
EP20K300EBC672-1X Product Details

EP20K300EBC672-1X Overview


This package is included in the 672-BBGA package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block contains 11520 logic elements or cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. FPGAs belonging to the APEX-20KE? series are a type of FPGA that belong to the APEX-20KE? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. It is for space saving reasons that this FPGA model is contained in Tray. A device like this one offers 147456 RAM bits, which is a considerable amount of memory. A total of 1152 LABs/CLBs are included in this FPGA. Its basic building block contains 728000 gates. There is a device package provided by 672-FBGA (27x27), which is the supplier.

EP20K300EBC672-1X Features


408 I/Os
Up to 147456 RAM bits

EP20K300EBC672-1X Applications


There are a lot of Intel EP20K300EBC672-1X FPGAs applications.

  • High Performance Computing
  • Medical Applications
  • Space Applications
  • Enterprise networking
  • Data Center
  • Audio
  • DO-254
  • Secure Communication
  • ASIC prototyping
  • Aircraft navigation

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