EP2A25B724-C7 Overview

There are two packages that contain fpga chips: 724-BBGA, FCBGA package and X package. Fpga chips consists of LOADABLE PLD elements. A total of 540 I/Os are programmed to ensure a more coherent data transfer. Logic blocks consist of 24320 logic elements/cells. Fpga chips is powered from a supply voltage of 1.5V. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 1.425V~1.575V-volt supply voltage required for the device to operate. There are many types of FPGAs in the APEX II series, this is one of them. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. As a space-saving measure, this FPGA model is contained within Tray. There are a total of 724 terminations. The RAM bits that this device offer is 622592. A total of 2430 LABs/CLBs make up this FPGA array. As a basic building block, fpga semiconductor consists of 2750000 gates.

EP2A25B724-C7 Features

540 I/Os
Up to 622592 RAM bits

EP2A25B724-C7 Applications

There are a lot of Intel EP2A25B724-C7 FPGAs applications.

• ADAS
• Integrating multiple SPLDs
• Space Applications
• Automation
• Secure Communication
• Aircraft navigation
• Wired Communications
• Distributed Monetary Systems
• Data Mining
• Artificial intelligence (AI)