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EP2AGX190FF35I3

EP2AGX190FF35I3

EP2AGX190FF35I3

Intel

FPGAs Arria II GX Series 1152-BBGA, FCBGA

SOT-23

EP2AGX190FF35I3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria II GX
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN LEAD
Voltage - Supply 0.87V~0.93V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number EP2AGX190
Number of I/O 612
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 181165
Total RAM Bits 10177536
Number of LABs/CLBs 7612
RoHS Status Non-RoHS Compliant
EP2AGX190FF35I3 Product Details

EP2AGX190FF35I3 Overview


As part of the 1152-BBGA, FCBGA package, it is included. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 612 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 181165 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. In order to operate it, it requires a voltage supply of 0.87V~0.93V . It is a type of FPGA that belongs to the Arria II GX series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Having a RAM bit size of 10177536 means that this device will offer you a lot of memory. You can find related parts by using the part number EP2AGX190, which is its base part number. Fpga electronics contains 7612 LABs/CLBs in an array.

EP2AGX190FF35I3 Features


612 I/Os
Up to 10177536 RAM bits

EP2AGX190FF35I3 Applications


There are a lot of Intel EP2AGX190FF35I3 FPGAs applications.

  • Data Center
  • ASIC prototyping
  • Military DSP
  • DO-254
  • Space Applications
  • Broadcast
  • Voice recognition
  • Integrating multiple SPLDs
  • Medical imaging
  • Embedded Vision

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