Welcome to Hotenda.com Online Store!

logo
userjoin
Home

EP2AGX260FF35I3G

EP2AGX260FF35I3G

EP2AGX260FF35I3G

Intel

FPGAs Arria II GX Series 1152-BBGA, FCBGA

SOT-23

EP2AGX260FF35I3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Operating Temperature-40°C~100°C TJ
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 612
Number of Logic Elements/Cells 244188
Total RAM Bits 12038144
Number of LABs/CLBs 10260
RoHS StatusRoHS Compliant
In-Stock:2825 items

EP2AGX260FF35I3G Product Details

EP2AGX260FF35I3G Overview


The package that contains this software is called 1152-BBGA, FCBGA. There are 612 I/Os for better data transfer. A fundamental building block consists of 244188 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 0.87V~0.93V and uses a battery to supply power. An FPGA belonging to the Arria II GX series is referred to as an FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga electronics is worth mentioning that this device provides 12038144 bfpga electronics s of RAM. An array of 10260 LABs/CLBs is built into the FPGA. It employs 1152-FBGA (35x35) as its supplier device package.

EP2AGX260FF35I3G Features


612 I/Os
Up to 12038144 RAM bits

EP2AGX260FF35I3G Applications


There are a lot of Intel EP2AGX260FF35I3G FPGAs applications.

  • Space Applications
  • Device controllers
  • Camera time adjustments
  • Data center hardware accelerators
  • ADAS
  • Broadcast
  • Industrial,Medical and Scientific Instruments
  • Video & Image Processing
  • Enterprise networking
  • Artificial intelligence (AI)

Get Subscriber

Enter Your Email Address, Get the Latest News