EP3C25E144C8 Overview
There are two packages that contain fpga chips: 144-LQFP Exposed Pad package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 82 I/Os are available for transferring data more efficiently. Logic blocks consist of 24624 logic elements/cells. 1.2V volts power it. Field Programmable Gate Arrays family FPGA part. This FPGA module can be attached to the development board with a Surface Mount. In order for it to operate, the supply voltage must be 1.15V~1.25V . It is a type of FPGA that belongs to the Cyclone? III series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. In this device, there are 82 outputs that can be used. As a space-saving measure, this FPGA model is contained within Tray. The total number of terminations is 144. A device like this one offers 608256 RAM bits, which is a considerable amount of memory. If you are looking for related parts, you can use the base part number EP3C25 as a starting point. A total of 1539 LABs/CLBs make up this FPGA array. Typically, it uses a crystal oscillating at 472.5MHz in order to operate.
EP3C25E144C8 Features
82 I/Os
Up to 608256 RAM bits
EP3C25E144C8 Applications
There are a lot of Intel EP3C25E144C8 FPGAs applications.
- Development Boards and Shields for Microcontrollers
- Audio
- ASIC prototyping
- Data center hardware accelerators
- Space Applications
- Automotive driver's assistance
- Aerospace and Defense
- Broadcast
- Voice recognition
- Data Mining
