EP3SL70F484I4LG Overview

There are two packages that contain fpga chips: 484-BBGA, FCBGA package and X package. Fpga chips is programmed wFpga chipsh 296 I/Os for transferring data in a more coherent manner. A fundamental building block is made up of 67500 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. A supply voltage of 0.86V~1.15V is needed in order for fpga chips to operate. It is a type of FPGA belonging to the Stratix? III L seies. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. Having a RAM bit size of 2699264 means that this device will offer you a lot of memory. The FPGA is built as an array of 2700 latches or CLBs.

EP3SL70F484I4LG Features

296 I/Os
Up to 2699264 RAM bits

EP3SL70F484I4LG Applications

There are a lot of Intel EP3SL70F484I4LG FPGAs applications.

• Camera time adjustments
• Automotive driver's assistance
• Integrating multiple SPLDs
• Industrial Ethernet
• Data center hardware accelerators
• Military Temperature
• Space Applications
• Voice recognition
• Software-defined radios
• Automation