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EP3SL70F780I3G

EP3SL70F780I3G

EP3SL70F780I3G

Intel

FPGAs Stratix? III L Series 780-BBGA, FCBGA

SOT-23

EP3SL70F780I3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature-40°C~100°C TJ
Series Stratix® III L
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 488
Number of Logic Elements/Cells 67500
Total RAM Bits 2699264
Number of LABs/CLBs 2700
RoHS StatusRoHS Compliant
In-Stock:4171 items

EP3SL70F780I3G Product Details

EP3SL70F780I3G Overview


As part of the 780-BBGA, FCBGA package, it is included. A total of 488 I/Os allow data to be transferred in a more coherent manner. A fundamental building block contains 67500 logic elements or cells. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.86V~1.15V battery. As part of the Stratix? III L series of FPGAs, it is a type of FPGA. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. The RAM bits that are offered by this fpga chips are 2699264. 2700 LABs/CLBs are configured on this FPGA. There is a device package provided by 780-FBGA (29x29) as its supplier.

EP3SL70F780I3G Features


488 I/Os
Up to 2699264 RAM bits

EP3SL70F780I3G Applications


There are a lot of Intel EP3SL70F780I3G FPGAs applications.

  • Automotive
  • Automotive advanced driver assistance systems (ADAS)
  • Data Center
  • Automotive Applications
  • Broadcast
  • Data center hardware accelerators
  • Software-defined radio
  • DO-254
  • ASIC prototyping
  • Defense Applications

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