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EP4SGX110DF29C3G

EP4SGX110DF29C3G

EP4SGX110DF29C3G

Intel

FPGAs Stratix? IV GX Series 780-BBGA, FCBGA

SOT-23

EP4SGX110DF29C3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Operating Temperature0°C~85°C TJ
Series Stratix® IV GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 372
Number of Logic Elements/Cells 105600
Total RAM Bits 9793536
Number of LABs/CLBs 4224
RoHS StatusRoHS Compliant
In-Stock:3727 items

EP4SGX110DF29C3G Product Details

EP4SGX110DF29C3G Overview


There are two packages that contain fpga chips: 780-BBGA, FCBGA package and X package. Fpga chips is programmed wFpga chipsh 372 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 105600 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.87V~0.93V supply voltage, fpga chips is able to operate at high speeds. There are many types of FPGAs in the Stratix? IV GX series, this is one of them. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. Having a RAM bit size of 9793536 means that this device will offer you a lot of memory. The FPGA is built as an array of 4224 latches or CLBs.

EP4SGX110DF29C3G Features


372 I/Os
Up to 9793536 RAM bits

EP4SGX110DF29C3G Applications


There are a lot of Intel EP4SGX110DF29C3G FPGAs applications.

  • Automotive advanced driver assistance systems (ADAS)
  • Military Temperature
  • OpenCL
  • Wireless Communications
  • Data center search engines
  • Aircraft navigation
  • Cryptography
  • Filtering and communication encoding
  • Device controllers
  • High Performance Computing

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