EPF10K130EBC600-1E Overview

There are two packages that contain fpga chips: 600-BGA package and X package. A total of 424 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 6656 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. Powered by a 2.375V~2.625V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the FLEX-10KE? series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~70°C TA while the machine is operating. As a result of space limitations, this FPGA model has been included in Tray. Having a RAM bit size of 65536 means that this device will offer you a lot of memory. This FPGA is built as an array of 832 LABs/CLBs. There are 342000 gates that make up its basic building block. 600-BGA (45x45) stands for its supplier device package.

EPF10K130EBC600-1E Features

424 I/Os
Up to 65536 RAM bits

EPF10K130EBC600-1E Applications

There are a lot of Intel EPF10K130EBC600-1E FPGAs applications.

• Aircraft navigation
• ASIC prototyping
• Data Mining
• Image processing
• Software-defined radio
• Secure Communication
• Data center search engines
• Camera time adjustments
• Radar and Sensors
• Data Center