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EPF10K200SBC672-1X

EPF10K200SBC672-1X

EPF10K200SBC672-1X

Intel

FPGAs FLEX-10KS? Series 672-BBGA

SOT-23

EPF10K200SBC672-1X Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 672-BBGA
Supplier Device Package 672-FBGA (27x27)
Operating Temperature0°C~70°C TA
PackagingTray
Series FLEX-10KS®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.375V~2.625V
Number of I/O 470
Number of Logic Elements/Cells 9984
Total RAM Bits 98304
Number of Gates513000
Number of LABs/CLBs 1248
In-Stock:2695 items

EPF10K200SBC672-1X Product Details

EPF10K200SBC672-1X Overview


Fpga chips is supplied in the 672-BBGA package. There are 470 I/Os for better data transfer. Logic elements/cells form the fundamental building block of a computer. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 2.375V~2.625V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the FLEX-10KS? series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~70°C TA when operating the machine. There is an FPGA model contained in Tray in order to conserve space. This device is equipped with 98304 RAM bits in terms of its RAM si98304e. This FPGA is built as an array of 1248 LABs/CLBs. A basic building block for this type of building block consists of 513000 gates. Its supplier package is called 672-FBGA (27x27).

EPF10K200SBC672-1X Features


470 I/Os
Up to 98304 RAM bits

EPF10K200SBC672-1X Applications


There are a lot of Intel EPF10K200SBC672-1X FPGAs applications.

  • Wireless Communications
  • Aerospace and Defense
  • Embedded Vision
  • ADAS
  • DO-254
  • Military DSP
  • Bioinformatics
  • Radar and Sensors
  • Industrial,Medical and Scientific Instruments
  • Camera time adjustments

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