EPF10K50VFC484-3N Overview

There are two packages that contain fpga chips: 484-BBGA package and X package. Fpga chips consists of LOADABLE PLD elements. A total of 291 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 2880 logic elements/cells. Power is provided by a 3.3V-volt supply. There is a Field Programmable Gate Arrays family component in this FPGA part. This FPGA module can be attached to the development board with a Surface Mount. Powered by a 3V~3.6V supply voltage, fpga chips is able to operate at high speeds. An FPGA belonging to the FLEX-10K? series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~70°C TA when the device is operating. In this device, 59 outputs are incorporated in order to provide you with maximum flexibility. In order to save space, this FPGA model has been contained in Tray. In total, there are a total of 484 terminations on fpga chips. As far as the RAM bits are concerned, this device offers you a total of 20480. For related parts, use its base part number EPF10K50. 360 LABs and CLBs are built into this FPGA. An external power supply of 3.3V is required to power the device. 116000 gates make up the basic block of its construction. It has 4 dedicated inputs in which the status of the signals on the input is detected.

EPF10K50VFC484-3N Features

291 I/Os
Up to 20480 RAM bits

EPF10K50VFC484-3N Applications

There are a lot of Intel EPF10K50VFC484-3N FPGAs applications.

• Cryptography
• Distributed Monetary Systems
• Medical Applications
• Automotive
• Military DSP
• Military Temperature
• Automotive Applications
• Space Applications
• Wireless Communications
• Wired Communications