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EPF10K50VQC240-3AA

EPF10K50VQC240-3AA

EPF10K50VQC240-3AA

Intel

FPGAs FLEX-10K? Series 240-BQFP

SOT-23

EPF10K50VQC240-3AA Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 240-BQFP
Supplier Device Package 240-PQFP (32x32)
Operating Temperature 0°C~70°C TA
Packaging Tray
Series FLEX-10K®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3V~3.6V
Number of I/O 189
Number of Logic Elements/Cells 2880
Total RAM Bits 20480
Number of Gates 116000
Number of LABs/CLBs 360
EPF10K50VQC240-3AA Product Details

EPF10K50VQC240-3AA Overview


In the 240-BQFP package, you will find fpga chips. This device features 189 I/Os in order to transfer data in a more efficient manner. Logic elements/cells form the fundamental building block of a computer. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 3V~3.6V. The FLEX-10K? Series is one of the types of FPGAs that belong to this type. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~70°C TA while the machine is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 20480 bFpga chipss. A total of 360 LABs/CLBs make up this FPGA array. The basic building block of this system consists of 116000 gates. There is a device package provided by 240-PQFP (32x32), which is the supplier.

EPF10K50VQC240-3AA Features


189 I/Os
Up to 20480 RAM bits

EPF10K50VQC240-3AA Applications


There are a lot of Intel EPF10K50VQC240-3AA FPGAs applications.

  • High Performance Computing
  • Bioinformatics
  • Ecosystem
  • Data Center
  • Distributed Monetary Systems
  • Development Boards and Shields for Microcontrollers
  • Military Temperature
  • Scientific Instruments
  • Audio
  • Industrial IoT

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