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EPF6024ABI256-2

EPF6024ABI256-2

EPF6024ABI256-2

Intel

FPGAs FLEX 6000 Series 256-BBGA

SOT-23

EPF6024ABI256-2 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 256-BBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series FLEX 6000
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3V~3.6V
Base Part Number EPF6024
Number of I/O 218
Number of Logic Elements/Cells 1960
Number of Gates 24000
Number of LABs/CLBs 196
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $17.813333 $17.813333
10 $16.805031 $168.05031
100 $15.853803 $1585.3803
500 $14.956418 $7478.209
1000 $14.109828 $14109.828
EPF6024ABI256-2 Product Details

EPF6024ABI256-2 Overview


This package is included in the 256-BBGA package and is available for purchase. Its 218 I/Os help it transfer data more efficiently. To form a fundamental building block, there are 1960 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order for it to operate, the supply voltage must be 3V~3.6V . As part of the FLEX 6000 series of FPGAs, it is a type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. A model of this FPGA is contained in Tray for the purpose of saving space. For related parts, use its base part number EPF6024. An array of 196 LABs/CLBs is built into the FPGA. There are 24000 gates that make up its basic building block.

EPF6024ABI256-2 Features


218 I/Os

EPF6024ABI256-2 Applications


There are a lot of Intel EPF6024ABI256-2 FPGAs applications.

  • Medical Applications
  • Camera time adjustments
  • Voice recognition
  • Audio
  • Distributed Monetary Systems
  • Medical imaging
  • ASIC prototyping
  • Integrating multiple SPLDs
  • Computer hardware emulation
  • Bioinformatics

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