EPM1270F256C5 Overview

A mobile phone network consists of 980macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).256-BGA is the package in which it resides.There are 212 I/Os programmed in it.The device is programmed with 256 terminations.As the terminal position of this electrical part is BOTTOM, it serves as an important access point for passengers and freight.Power is provided by a supply voltage of 2.5V volts.It is included in Programmable Logic Devices.As a result, it is packaged as Tray.To ensure its reliability, the operating temperature is set to 0°C~85°C TJ.The chip should be mounted by Surface Mount.It belongs to the MAX® IIseries of FPGAs.When using this device, IT CAN ALSO OPERATE AT 3.3V can also be found.The EPM1270 indicates that its related parts can be found.There are 1270 logic elements/blocks.The system runs on a power supply of 1.5/3.32.5/3.3V watts.In this case, the maximum supply voltage (Vsup) reaches 2.625V.It is recommended that the supply voltage (Vsup) be greater than 2.375V.

EPM1270F256C5 Features

256-BGA package
212 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM1270F256C5 Applications

There are a lot of Intel
EPM1270F256C5 CPLDs applications.

• Voltage level translation
• Timing control
• Interface bridging
• I/O expansion
• Discrete logic functions
• Bootloaders for FPGAs
• Address decoders
• Custom state machines
• Digital systems
• Portable digital devices