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EPM1270GF256C4

EPM1270GF256C4

EPM1270GF256C4

Intel

1.5/3.31.8V 1mm PMIC MAX? II Series EPM1270 1.8V 256-BGA

SOT-23

EPM1270GF256C4 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.8V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number EPM1270
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 212
Propagation Delay 8.1 ns
Output Function MACROCELL
Number of Macro Cells 980
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 6.2ns
Number of Logic Elements/Blocks 1270
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $418.519230 $418.51923
10 $394.829463 $3948.29463
100 $372.480625 $37248.0625
500 $351.396816 $175698.408
1000 $331.506430 $331506.43
EPM1270GF256C4 Product Details

EPM1270GF256C4 Overview


The mobile phone network has 980 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).256-BGAis the package in which it resides.It is equipped with 212I/O ports.The device is programmed with 256 terminations.As the terminal position of this electrical part is [0], it serves as an important access point for passengers and freight.The power source is powered by 1.8Vvolts.It is a part of family [0].It is recommended that the chip be packaged by Tray.In order to ensure the reliability of the device, it is designed to operate at a temperature of [0].The chip should be mounted by Surface Mount.In this case, it is a type of FPGA belonging to the MAX? II series.When using this device, YESis also available.The EPM1270can be used to identify its related parts.1270logic elements/blocks exist.The system runs on a power supply of 1.5/3.31.8V watts.1.89Vrepresents the maximal supply voltage (Vsup).Vsup (supply voltage) must be greater than 1.71V.

EPM1270GF256C4 Features


256-BGA package
212 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM1270GF256C4 Applications


There are a lot of Intel EPM1270GF256C4 CPLDs applications.

  • DDC INTERFACE
  • Bootloaders for FPGAs
  • Auxiliary Power Supply Isolated and Non-isolated
  • ANALOG-TO-DIGITAL CONVERTOR (ADC)
  • Software-Driven Hardware Configuration
  • Digital multiplexers
  • Power automation
  • INTERRUPT SYSTEM
  • Reset swapping
  • PLC analog input modules

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