EPM2210F256C3N Overview

In the mobile phone network, there are 1700macro cells, which are cells with high-power antennas and towers.You can find it in package [0].In this case, there are 204 I/Os programmed.The device is programmed with 256 terminations.This electrical part has a terminal position of BOTTOMand is connected to the ground.A voltage of 2.5V is used as the power supply for this device.It belongs to the family [0].Trayis the packaging method.In order to ensure the reliability of the device, it is designed to operate at a temperature of [0].It is mounted in the way of Surface Mount.FPGAs belonging to the MAX? IIseries contain this type of chip.If you use this device, you will also find [0].Its related parts can be found in the [0].A total of 2210logic elements/blocks are present.A power supply of 1.5/3.32.5/3.3Vis required to operate it.In this case, the maximum supply voltage (Vsup) reaches 2.625V.Vsup (supply voltage) must be greater than 2.375V.

EPM2210F256C3N Features

256-BGA package
204 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM2210F256C3N Applications

There are a lot of Intel EPM2210F256C3N CPLDs applications.

• SUPERVISORY FUNCTION (LVD AND WATCHDOG)
• Preset swapping
• Programmable power management
• Code converters
• Portable digital devices
• Software-driven hardware configuration
• Voltage level translation
• Digital designs
• Configurable Addressing of I/O Boards
• ToR/Aggregation/Core Switch and Router