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EPM2210F324C4N

EPM2210F324C4N

EPM2210F324C4N

Intel

1.5/3.32.5/3.3V 1mm PMIC MAX® II Series EPM2210 2.5V 324-BGA

SOT-23

EPM2210F324C4N Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
Terminal Finish TIN SILVER COPPER
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM2210
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 272
Propagation Delay 9.1 ns
Output Function MACROCELL
Number of Macro Cells 1700
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210
Height Seated (Max) 2.2mm
Length 19mm
Width 19mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $66.415879 $66.415879
10 $62.656490 $626.5649
100 $59.109896 $5910.9896
500 $55.764053 $27882.0265
1000 $52.607597 $52607.597
EPM2210F324C4N Product Details

EPM2210F324C4N Overview


There are 1700 macro cells in the network, which are high-power cell sites that provide radio coverage (tower, antenna, or mast) for a mobile phone network.It is part of the 324-BGA package.The device has 272 inputs and outputs.There are 324 terminations programmed into the device.As the terminal position of this electrical part is BOTTOM, it serves as an important access point for passengers or freight.Power is supplied by a voltage of 2.5V volts.The part is included in Programmable Logic Devices.The chip should be packaged by Tray.The temperature at which it operates is set to 0°C~85°C TJ in order to ensure its reliability.Surface Mount should be used for mounting the chip.The MAX® II series comprises this type of FPGA.The device can also be used to find IT CAN ALSO OPERATE AT 3.3V.The EPM2210 indicates that related parts can be found.There are 2210 logic elements or blocks present.In order for the device to operate, it requires 1.5/3.32.5/3.3V power supplies.Vsup reaches 2.625V as the maximum supply voltage.A supply voltage (Vsup) of greater than 2.375V should be used.

EPM2210F324C4N Features


324-BGA package
272 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies


EPM2210F324C4N Applications


There are a lot of Intel
EPM2210F324C4N CPLDs applications.


  • Interface bridging
  • I/O expansion
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Address decoders
  • Custom state machines
  • Digital systems
  • Portable digital devices
  • Handheld digital devices
  • Battery operated portable devices

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