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EPM2210GF324C3N

EPM2210GF324C3N

EPM2210GF324C3N

Intel

1.5/3.31.8V 1mm PMIC MAX? II Series EPM2210 1.8V 324-BGA

SOT-23

EPM2210GF324C3N Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991
Terminal Finish TIN SILVER COPPER
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM2210
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 272
Propagation Delay 7 ns
Output Function MACROCELL
Number of Macro Cells 1700
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 7ns
Number of Logic Elements/Blocks 2210
Height Seated (Max) 2.2mm
Length 19mm
Width 19mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $14.349886 $14.349886
10 $13.537628 $135.37628
100 $12.771347 $1277.1347
500 $12.048441 $6024.2205
1000 $11.366454 $11366.454
EPM2210GF324C3N Product Details

EPM2210GF324C3N Overview


There are 1700 macro cells. A macro cell is a cell in a mobile phone network that provides radio coverage through the use of a high-power cell site (tower, antenna or mast).A 324-BGA package contains the item.It is programmed with 272 I/Os.324terminations are programmed into the device.This electrical part has a terminal position of BOTTOMand is connected to the ground.It is powered from a supply voltage of 1.8V.This part is part of the family [0].Package the chip by Tray.It operates with the operating temperature of 0°C~85°C TJ to ensure its reliability.Ensure that the chip is mounted by Surface Mount.As part of the MAX? IIseries, it is a type of FPGA.If you use this device, you will also find [0].Its related parts can be found in the [0].2210logic blocks/elements are present.This device runs on 1.5/3.31.8Vvolts of electricity.In this case, the maximum supply voltage (Vsup) is 1.89V.A supply voltage (Vsup) of greater than 1.71V should be used.

EPM2210GF324C3N Features


324-BGA package
272 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM2210GF324C3N Applications


There are a lot of Intel EPM2210GF324C3N CPLDs applications.

  • Address decoders
  • Power automation
  • Voltage level translation
  • Wide Vin Industrial low power SMPS
  • Power up sequencing
  • PULSE WIDTH MODULATION (PWM)
  • ON-CHIP OSCILLATOR CIRCUIT
  • D/T registers and latches
  • Random logic replacement
  • Multiple Clock Source Selection

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