EPM2210GF324C5 Overview

In the mobile phone network, there are 1700macro cells, which are cells with high-power antennas and towers.It is embedded in the 324-BGA package.The device is programmed with 272 I/Os.It is programmed to terminate devices at [0].BOTTOMis the terminal position of this electrical part.There is 1.8V voltage supply for this device.This part is part of the family [0].Ideally, the chip should be packaged by Tray.It operates with the operating temperature of 0°C~85°C TJ to ensure its reliability.It is recommended that the chip be mounted by Surface Mount.In this case, it is a type of FPGA belonging to the MAX? II series.When using this device, YEScan also be found.The EPM2210contains its related parts.A logic element or block has 2210elements.There is 1.5/3.31.8V power supply available for it.Supply voltage (Vsup) reaches a maximum of 1.89V.Vsup (supply voltage) must be greater than 1.71V.

EPM2210GF324C5 Features

324-BGA package
272 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM2210GF324C5 Applications

There are a lot of Intel EPM2210GF324C5 CPLDs applications.

• Discrete logic functions
• Synchronous or asynchronous mode
• Interface bridging
• Software-Driven Hardware Configuration
• PULSE WIDTH MODULATION (PWM)
• Page register
• Custom shift registers
• ROM patching
• Digital multiplexers
• I/O expansion