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EPM570F256C5N

EPM570F256C5N

EPM570F256C5N

Intel

1.5/3.32.5/3.3V 1mm PMIC MAX? II Series EPM570 2.5V 256-BGA

SOT-23

EPM570F256C5N Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 2.5V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Base Part Number EPM570
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/3.32.5/3.3V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 160
Propagation Delay 8.7 ns
Output Function MACROCELL
Number of Macro Cells 440
JTAG BST YES
Voltage Supply - Internal 2.5V 3.3V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $17.208442 $17.208442
10 $16.234379 $162.34379
100 $15.315451 $1531.5451
500 $14.448539 $7224.2695
1000 $13.630698 $13630.698
EPM570F256C5N Product Details

EPM570F256C5N Overview


This network has 440macro cells, which are cells that provide radio coverage provided by a high-power cell site (tower, antenna, mast).It is part of the 256-BGA package.There are 160 I/Os programmed in it.There are 256 terminations programmed into the device.As the terminal position of this electrical part is [0], it serves as an important access point for passengers and freight.It is powered by a voltage of 2.5V volts.It belongs to the family [0].Trayis the packaging method.The device operates at a temperature of 0°C~85°C TJin order to ensure its reliability.The chip should be mounted by Surface Mount.FPGAs belonging to the MAX? IIseries contain this type of chip.This device also displays [0].EPM570contains its related parts.There are 570 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.The system runs on a power supply of 1.5/3.32.5/3.3V watts.Initially, the maximum supply voltage (Vsup) is 2.625V.Ensure that the supply voltage (Vsup) exceeds 2.375V.

EPM570F256C5N Features


256-BGA package
160 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.32.5/3.3V power supplies

EPM570F256C5N Applications


There are a lot of Intel EPM570F256C5N CPLDs applications.

  • ToR/Aggregation/Core Switch and Router
  • Multiple Clock Source Selection
  • White goods (Washing, Cold, Aircon ,...)
  • POWER-SAVING MODES
  • Wireless Infrastructure Base Band Unit and Remote Radio Unit
  • Address decoding
  • LED Lighting systems
  • Wide Vin Industrial low power SMPS
  • Portable digital devices
  • Synchronous or asynchronous mode

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