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EPM570GF256C3

EPM570GF256C3

EPM570GF256C3

Intel

1.5/3.31.8V 1mm PMIC MAX? II Series EPM570 1.8V 256-BGA

SOT-23

EPM570GF256C3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2014
Series MAX® II
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.8V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number EPM570
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 160
Propagation Delay 5.4 ns
Output Function MACROCELL
Number of Macro Cells 440
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $741.275825 $741.275825
10 $699.316816 $6993.16816
100 $659.732845 $65973.2845
500 $622.389477 $311194.7385
1000 $587.159883 $587159.883
EPM570GF256C3 Product Details

EPM570GF256C3 Overview


440 macrocells are present in the mobile phone network, which offer radio coverage from a high-power cell tower, antenna, or mast.The product is contained in a 256-BGA package.There are 160 I/Os on the board.There are 256 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.As the terminal position of this electrical part is [0], it serves as an important access point for passengers and freight.It is powered from a supply voltage of 1.8V.This part is part of the family [0].Trayshould be used for packaging the chip.It operates with the operating temperature of 0°C~85°C TJ to ensure its reliability.It is recommended that the chip be mounted by Surface Mount.The FPGA belongs to the MAX? II series.It is also characterized by YES.In accordance with the [0], its related parts are listed.There are 570 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.This device runs on 1.5/3.31.8Vvolts of electricity.1.89Vis the maximum supply voltage (Vsup).Ensure that the supply voltage (Vsup) exceeds 1.71V.

EPM570GF256C3 Features


256-BGA package
160 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM570GF256C3 Applications


There are a lot of Intel EPM570GF256C3 CPLDs applications.

  • Digital designs
  • Dedicated input registers
  • ANALOG-TO-DIGITAL CONVERTOR (ADC)
  • Reset swapping
  • Cross-Matrix Switch
  • PLC analog input modules
  • Multiple DIP Switch Replacement
  • Power Meter SMPS
  • ON-CHIP OSCILLATOR CIRCUIT
  • Bootloaders for FPGAs

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