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EPM570GF256C3N

EPM570GF256C3N

EPM570GF256C3N

Intel

1.5/3.31.8V 1mm PMIC MAX? II Series EPM570 1.8V 256-BGA

SOT-23

EPM570GF256C3N Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® II
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Additional Feature IT CAN ALSO OPERATE AT 3.3V
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EPM570
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.5/3.31.8V
Supply Voltage-Min (Vsup) 1.71V
Programmable Type In System Programmable
Number of I/O 160
Propagation Delay 5.4 ns
Output Function MACROCELL
Number of Macro Cells 440
JTAG BST YES
Voltage Supply - Internal 1.71V~1.89V
Delay Time tpd(1) Max 5.4ns
Number of Logic Elements/Blocks 570
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $636.480960 $636.48096
10 $600.453736 $6004.53736
100 $566.465789 $56646.5789
500 $534.401687 $267200.8435
1000 $504.152536 $504152.536
EPM570GF256C3N Product Details

EPM570GF256C3N Overview


The mobile phone network has 440 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).The product is contained in a 256-BGA package.As you can see, this device has 160 I/O ports programmed into it.There are 256 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.BOTTOMis the terminal position of this electrical part.It is powered from a supply voltage of 1.8V.It is a part of family [0].It is recommended that the chip be packaged by Tray.The operating temperature of the machine is 0°C~85°C TJ to ensure its reliability.It is recommended that Surface Mountholds the chip in place.The MAX? IIseries FPGA is one of these types.This device is also capable of displaying [0].The EPM570can be used to identify its related parts.There are a total of 570 logic elements or blocks.It operates from 1.5/3.31.8V power supplies.In order to ensure proper operation, a maximum supply voltage (Vsup) of 1.89V is required.It should be possible for Vsup to exceed 1.71Vat the supply voltage.

EPM570GF256C3N Features


256-BGA package
160 I/Os
The operating temperature of 0°C~85°C TJ
1.5/3.31.8V power supplies

EPM570GF256C3N Applications


There are a lot of Intel EPM570GF256C3N CPLDs applications.

  • SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
  • Network Interface Card (NIC) and Host Bus Adapter (HBA)
  • I2C BUS INTERFACE
  • Page register
  • Complex programmable logic devices
  • Power up sequencing
  • Code converters
  • Custom shift registers
  • ROM patching
  • Boolean function generators

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