1.5/3.31.8V 0.5mm PMIC MAX? II Series EPM570 1.8V 256-TFBGA
SOT-23
EPM570GM256I5N Datasheet
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In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
8 Weeks
Mounting Type
Surface Mount
Package / Case
256-TFBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
MAX® II
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
ECCN Code
EAR99
Terminal Finish
TIN SILVER COPPER
Additional Feature
IT CAN ALSO OPERATE AT 3.3V
HTS Code
8542.39.00.01
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.8V
Terminal Pitch
0.5mm
Time@Peak Reflow Temperature-Max (s)
40
Base Part Number
EPM570
JESD-30 Code
R-PBGA-B256
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.89V
Power Supplies
1.5/3.31.8V
Supply Voltage-Min (Vsup)
1.71V
Programmable Type
In System Programmable
Number of I/O
160
Propagation Delay
8.7 ns
Output Function
MACROCELL
Number of Macro Cells
440
JTAG BST
YES
Voltage Supply - Internal
1.71V~1.89V
Delay Time tpd(1) Max
5.4ns
Number of Logic Elements/Blocks
570
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
528
$37.87023
$19995.48144
EPM570GM256I5N Product Details
EPM570GM256I5N Overview
A mobile phone network consists of 440macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).You can find it in package [0].The device is programmed with 160 I/Os.It is programmed to terminate devices at [0].This electrical component has a terminal position of 0.The power supply voltage is 1.8V.It is a part of family [0].Ideally, the chip should be packaged by Tray.A reliable operation is ensured by the operating temperature of [0].Mount the chip by Surface Mount.FPGAs belonging to the MAX? IIseries contain this type of chip.It is also possible to find IT CAN ALSO OPERATE AT 3.3Vwhen using this device.In accordance with the [0], its related parts are listed.There are 570 logic elements/blocks.Currently, it is powered by 1.5/3.31.8Vsources.1.89Vrepresents the maximal supply voltage (Vsup).Vsup (supply voltage) must be greater than 1.71V.
EPM570GM256I5N Features
256-TFBGA package 160 I/Os The operating temperature of -40°C~100°C TJ 1.5/3.31.8V power supplies
EPM570GM256I5N Applications
There are a lot of Intel EPM570GM256I5N CPLDs applications.