EPM570ZM256I8N Overview

A mobile phone network consists of 440macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).The product is contained in a 256-TFBGA package.The device is programmed with 160 I/Os.Trayis the packaging method.A reliable operation is ensured by the operating temperature of [0].It is recommended that the chip be mounted by Surface Mount.As part of the MAX? IIseries, it is a type of FPGA.The EPM570can be used to identify its related parts.There are 570 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.

EPM570ZM256I8N Features

256-TFBGA package
160 I/Os
The operating temperature of -40°C~100°C TJ

EPM570ZM256I8N Applications

There are a lot of Intel EPM570ZM256I8N CPLDs applications.

• Custom state machines
• Wide Vin Industrial low power SMPS
• Voltage level translation
• ON-CHIP OSCILLATOR CIRCUIT
• TIMERS/COUNTERS
• DDC INTERFACE
• Digital multiplexers
• Digital designs
• PLC analog input modules
• I2C BUS INTERFACE