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EPM7256SRC208-7ES

EPM7256SRC208-7ES

EPM7256SRC208-7ES

Intel

PMIC MAX® 7000S Series 208-BFQFP Exposed Pad

SOT-23

EPM7256SRC208-7ES Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 208-BFQFP Exposed Pad
Supplier Device Package 208-RQFP (28x28)
Operating Temperature 0°C~70°C TA
Packaging Tray
Series MAX® 7000S
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Programmable Type In System Programmable
Number of I/O 164
Number of Gates 5000
Number of Macro Cells 256
Voltage Supply - Internal 4.75V~5.25V
Delay Time tpd(1) Max 7.5ns
Number of Logic Elements/Blocks 16
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $97.040096 $97.040096
10 $91.547260 $915.4726
100 $86.365340 $8636.534
500 $81.476736 $40738.368
1000 $76.864845 $76864.845
EPM7256SRC208-7ES Product Details

EPM7256SRC208-7ES Overview


A mobile phone network consists of 256macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).208-BFQFP Exposed Pad is the package in which it resides.There are 164 I/Os programmed in it.As a result, it is packaged as Tray.To ensure its reliability, the operating temperature is set to 0°C~70°C TA.The chip should be mounted by Surface Mount.It belongs to the MAX® 7000Sseries of FPGAs.5000 gates are devices that serve as building blocks for digital circuits.There are 16 logic elements/blocks.

EPM7256SRC208-7ES Features


208-BFQFP Exposed Pad package
164 I/Os
The operating temperature of 0°C~70°C TA


EPM7256SRC208-7ES Applications


There are a lot of Intel
EPM7256SRC208-7ES CPLDs applications.


  • Voltage level translation
  • Timing control
  • Interface bridging
  • I/O expansion
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Address decoders
  • Custom state machines
  • Digital systems
  • Portable digital devices

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