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EPM7512BFC256-7

EPM7512BFC256-7

EPM7512BFC256-7

Intel

1.8/3.32.5V 1mm PMIC MAX® 7000B Series EPM7512 2.5V 256-BGA

SOT-23

EPM7512BFC256-7 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series MAX® 7000B
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EPM7512
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.8/3.32.5V
Supply Voltage-Min (Vsup) 2.375V
Programmable Type In System Programmable
Number of I/O 212
Clock Frequency 163.9MHz
Propagation Delay 5.5 ns
Number of Gates 10000
Output Function MACROCELL
Number of Macro Cells 512
JTAG BST YES
Voltage Supply - Internal 2.375V~2.625V
Delay Time tpd(1) Max 7.5ns
Number of Logic Elements/Blocks 32
Height Seated (Max) 3.5mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $13.785287 $13.785287
10 $13.004988 $130.04988
100 $12.268857 $1226.8857
500 $11.574393 $5787.1965
1000 $10.919238 $10919.238
EPM7512BFC256-7 Product Details

EPM7512BFC256-7 Overview


There are 512 macro cells in the network, which are high-power cell sites that provide radio coverage (tower, antenna, or mast) for a mobile phone network.It is part of the 256-BGA package.The device has 212 inputs and outputs.There are 256 terminations programmed into the device.As the terminal position of this electrical part is BOTTOM, it serves as an important access point for passengers or freight.Power is supplied by a voltage of 2.5V volts.The part is included in Programmable Logic Devices.The chip should be packaged by Tray.The temperature at which it operates is set to 0°C~70°C TA in order to ensure its reliability.Surface Mount should be used for mounting the chip.The MAX® 7000B series comprises this type of FPGA.The device can also be used to find YES.The EPM7512 indicates that related parts can be found.It is possible to construct digital circuits using 10000 gates, which are devices that serve as building blocks.There are 32 logic elements or blocks present.In order for the device to operate, it requires 1.8/3.32.5V power supplies.Vsup reaches 2.625V as the maximum supply voltage.A supply voltage (Vsup) of greater than 2.375V should be used.The clock frequency of the device should not exceed 163.9MHz.

EPM7512BFC256-7 Features


256-BGA package
212 I/Os
The operating temperature of 0°C~70°C TA
1.8/3.32.5V power supplies


EPM7512BFC256-7 Applications


There are a lot of Intel
EPM7512BFC256-7 CPLDs applications.


  • Interface bridging
  • I/O expansion
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Address decoders
  • Custom state machines
  • Digital systems
  • Portable digital devices
  • Handheld digital devices
  • Battery operated portable devices

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