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MS27467T19B35H

MS27467T19B35H

MS27467T19B35H

TE CONNECTIVITY LTD

MS27467T19B35H datasheet pdf and Unclassified product details from TE CONNECTIVITY LTD stock available on our website

SOT-23

MS27467T19B35H Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type CABLE
Shell Material ALUMINUM ALLOY
ECCN Code EAR99
Connector Type MIL SERIES CONNECTOR
Additional FeatureSTANDARD: MIL-DTL-38999
HTS Code8536.69.40.20
MIL Conformance YES
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 66
Shell Finish CADMIUM PLATED
Mating Information MULTIPLE MATING PARTS AVAILABLE
Contact Gender MALE
Empty Shell NO
Backshell Type SOLID
Body/Shell Style PLUG
Environmental Characteristics ENVIRONMENT RESISTANT
Shell Size 19
Termination Type CRIMP
Coupling Type BAYONET
In-Stock:94 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$119.58000$119.58
500$118.3842$59192.1
1000$117.1884$117188.4
1500$115.9926$173988.9
2000$114.7968$229593.6
2500$113.601$284002.5

About MS27467T19B35H

The MS27467T19B35H from TE CONNECTIVITY LTD is a high-performance microcontroller designed for a wide range of embedded applications. This component features MS27467T19B35H datasheet pdf and Unclassified product details from TE CONNECTIVITY LTD stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MS27467T19B35H, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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