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MX25L25735EZNI-12G

MX25L25735EZNI-12G

MX25L25735EZNI-12G

Macronix

3/3.3V V MX25xxx35/36 - MXSMIO? 8 Pin Memory IC MX25xxx35/36 - MXSMIO? Series 8mm mm

SOT-23

MX25L25735EZNI-12G Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2009
Series MX25xxx35/36 - MXSMIO™
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8
ECCN Code 3A991.B.1.A
Terminal Finish Tin (Sn)
Additional Feature ALSO CONFIGURABLE AS 256M X 1
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1.27mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 8
JESD-30 Code R-PDSO-N8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 256Mb 32M x 8
Memory Type Non-Volatile
Operating Mode SYNCHRONOUS
Clock Frequency 80MHz
Supply Current-Max 0.045mA
Memory Format FLASH
Memory Interface SPI
Organization 64MX4
Memory Width 4
Write Cycle Time - Word, Page 300μs, 5ms
Standby Current-Max 0.00008A
Memory Density 268435456 bit
Programming Voltage 2.7V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Alternate Memory Width 2
Height Seated (Max) 0.8mm
Length 8mm
Width 6mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
MX25L25735EZNI-12G Product Details

MX25L25735EZNI-12G Overview


There is a memory type Non-Volatile for this type of device. The case comes in the Tray style. There is a 8-WDFN Exposed Pad case embedded in it. The memory size of the chip is 256Mb 32M x 8 Mb. There is a mainstream memory format used by this device, which is called FLASH-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. There is a recommended mounting type of Surface Mount for it. On the chip, there are 8 terminations that are planted. In total, this part supports 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. With a clock frequency of 80MHz, the memory rotates on its own. This memory device has 8 pins, indicating it has 8 memory locations. Although it has all the merits this chip has, it is also equipped with ALSO CONFIGURABLE AS 256M X 1 to give a performance boost to the system. Talking about power supplies, this memory chip requires merely 3/3.3V. This part is part of the MX25xxx35/36 - MXSMIO? series of memory devices, which play a key role in its target applications. In order for the memory ics to transfer data to the CPU, this memory integrates with a SPI-type serial bus. The device is able to run from a max supply current of 0.045mA , so it can be used in any environment. The programming voltage required for certain nonvolatile memory arrays is 2.7V.

MX25L25735EZNI-12G Features


Package / Case: 8-WDFN Exposed Pad
Additional Feature:ALSO CONFIGURABLE AS 256M X 1

MX25L25735EZNI-12G Applications


There are a lot of Macronix MX25L25735EZNI-12G Memory applications.

  • mainframes
  • servers
  • nonvolatile BIOS memory
  • personal digital assistants
  • workstations,
  • hard disk drive (HDD)
  • Cache memory
  • networking
  • Camcorders
  • DVD disk buffer

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