3/3.3V V MX25xxx35/36 - MXSMIO? 8 Pin Memory IC MX25xxx35/36 - MXSMIO? Series 8mm mm
SOT-23
MX25L25735EZNI-12G Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
8-WDFN Exposed Pad
Surface Mount
YES
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2009
Series
MX25xxx35/36 - MXSMIO™
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
8
ECCN Code
3A991.B.1.A
Terminal Finish
Tin (Sn)
Additional Feature
ALSO CONFIGURABLE AS 256M X 1
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1.27mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Pin Count
8
JESD-30 Code
R-PDSO-N8
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Interface
SPI, Serial
Memory Size
256Mb 32M x 8
Memory Type
Non-Volatile
Operating Mode
SYNCHRONOUS
Clock Frequency
80MHz
Supply Current-Max
0.045mA
Memory Format
FLASH
Memory Interface
SPI
Organization
64MX4
Memory Width
4
Write Cycle Time - Word, Page
300μs, 5ms
Standby Current-Max
0.00008A
Memory Density
268435456 bit
Programming Voltage
2.7V
Serial Bus Type
SPI
Endurance
100000 Write/Erase Cycles
Data Retention Time-Min
20
Write Protection
HARDWARE/SOFTWARE
Alternate Memory Width
2
Height Seated (Max)
0.8mm
Length
8mm
Width
6mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
MX25L25735EZNI-12G Product Details
MX25L25735EZNI-12G Overview
There is a memory type Non-Volatile for this type of device. The case comes in the Tray style. There is a 8-WDFN Exposed Pad case embedded in it. The memory size of the chip is 256Mb 32M x 8 Mb. There is a mainstream memory format used by this device, which is called FLASH-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. There is a recommended mounting type of Surface Mount for it. On the chip, there are 8 terminations that are planted. In total, this part supports 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. With a clock frequency of 80MHz, the memory rotates on its own. This memory device has 8 pins, indicating it has 8 memory locations. Although it has all the merits this chip has, it is also equipped with ALSO CONFIGURABLE AS 256M X 1 to give a performance boost to the system. Talking about power supplies, this memory chip requires merely 3/3.3V. This part is part of the MX25xxx35/36 - MXSMIO? series of memory devices, which play a key role in its target applications. In order for the memory ics to transfer data to the CPU, this memory integrates with a SPI-type serial bus. The device is able to run from a max supply current of 0.045mA , so it can be used in any environment. The programming voltage required for certain nonvolatile memory arrays is 2.7V.
MX25L25735EZNI-12G Features
Package / Case: 8-WDFN Exposed Pad Additional Feature:ALSO CONFIGURABLE AS 256M X 1
MX25L25735EZNI-12G Applications
There are a lot of Macronix MX25L25735EZNI-12G Memory applications.