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MX25R512FZUIH1

MX25R512FZUIH1

MX25R512FZUIH1

Macronix

Memory IC 3mm mm

SOT-23

MX25R512FZUIH1 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Surface Mount YES
Packaging Tape & Reel (TR)
Published 2017
Part Status Active
Number of Terminations 8
Additional Feature ALSO ORGANISED AS 524,288 X 1
Technology CMOS
Terminal Position BOTTOM
Terminal Form BUTT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.5mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XBCC-B8
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Supply Voltage-Max (Vsup) 3.6V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.65V
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Organization 128KX4
Memory Width 4
Memory Density 524288 bit
Parallel/Serial SERIAL
Memory IC Type FLASH
Programming Voltage 1.8V
Alternate Memory Width 2
Height Seated (Max) 0.6mm
Length 3mm
Width 2mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
12,000 $0.30975 $3.717
MX25R512FZUIH1 Product Details

MX25R512FZUIH1 Overview


Tape & Reel (TR)-cases are available. The chip contains 8 terminations. This part supports as many as 1 functions for the comprehensive working procedure. An 1.8V supply is required for this ic memory chip to operate properly. A clock frequency rotation within 104MHz is used for the ic memory chip to rotate data. Despite all the merits of this chip, it also has ALSO ORGANISED AS 524,288 X 1 to boost system performance. A programming voltage of 1.8V is required to change a nonvolatile memory array's state. FLASH is the type of memory IC in this chip. Use it only at temperatures above 85°C. In order for the part to work, it must operate at a temperature of -40°C, otherwise it will not work

MX25R512FZUIH1 Features


Additional Feature:ALSO ORGANISED AS 524,288 X 1

MX25R512FZUIH1 Applications


There are a lot of Macronix MX25R512FZUIH1 Memory applications.

  • workstations,
  • eSRAM
  • mainframes
  • eDRAM
  • Camcorders
  • personal digital assistants
  • servers
  • hard disk drive (HDD)
  • Cache memory
  • supercomputers

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