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MX29GL512FHXGI-10Q

MX29GL512FHXGI-10Q

MX29GL512FHXGI-10Q

Macronix

Memory IC 9mm mm

SOT-23

MX29GL512FHXGI-10Q Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case TFBGA
Surface Mount YES
Number of Terminations 56
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code R-PBGA-B56
Supply Voltage-Max (Vsup) 3.6V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3V
Interface Parallel
Memory Type FLASH, NOR
Operating Mode ASYNCHRONOUS
Organization 32MX16
Memory Width 16
Memory Density 536870912 bit
Access Time (Max) 100 ns
Programming Voltage 3V
Alternate Memory Width 8
Length 9mm
Height Seated (Max) 1.2mm
Width 7mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
MX29GL512FHXGI-10Q Product Details

MX29GL512FHXGI-10Q Overview


FLASH, NOR is the type of memory it has. The TFBGA case contains it. The chip has 56 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 3.3V of power. This device must operate at a minimum temperature of -40°C. Temperatures no higher than 85°C degrees Celsius are recommended for operation. Nonvolatile memory arrays require 3V programming voltage to change their state.

MX29GL512FHXGI-10Q Features


Package / Case: TFBGA


MX29GL512FHXGI-10Q Applications


There are a lot of Macronix
MX29GL512FHXGI-10Q Memory applications.


  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,

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